高通骁龙888 5G旗舰处理器芯片发布

北京时间 2020-12-01日晚间，高通在2020年骁龙技术峰会上正式发布了骁龙888旗舰平台处理器，将支持下一代旗舰智能手机。

CPU核心

骁龙888采用全新的三星5nm工艺制造，八核心设计，首发Cortex-X1架构超级大核心，高通称之为“超级核心”(Super Core)，主频2.84GHz，同时搭载三个2.4GHz A78、四个1.8GHz A55 CPU核心、GPU图形核心升级到Adreno 660、新一代Hexagon DSP、第六代AI Engine、第二代Sensing Hub、新一代Spectra ISP，支持第三代Elite Gaming游戏平台，支持GPU驱动升级、144FPS高帧率。

集成5G基带

骁龙888也是高通首款集成式旗舰级5G SoC

骁龙 X60基带，支持 WiFi 6E、Bluetooth 5.2；搭载了第六代 AI 引擎和第二代传感中枢；以及搭载了更新的ISP，支持每秒拍摄2.7千兆像素的照片，或者以1200万像素分辨率拍摄大约120张照片/秒。

X60基带是高通的第三代5G基带，三星5nm工艺制造，支持5G FDD-TDD/TDD-TDD 6GHz以下频段载波聚合，支持毫米波-6GHz以下频段聚合，支持VoNR，可通过5G新空口提供高质量的语音服务，理论下行速率最高达7.5Gbps，下行则可达3Gbps。

Cortex X1

是ARM推出的第一款官方的超大核，在性能方面，Cortex-X1比Cortex-A77提高30%，与Cortex-A78相比，Cortex-X1的整数运算性能提升了23%，Cortex-X1还拥有两倍于Cortex-A78的机器学习能力。

智慧 (AI) 引擎

AIE GPU: Qualcomm® Adreno™ 660 GPU

AIE CPU: Qualcomm® Kryo™ 680 CPU

Hexagon Processor: Qualcomm® Hexagon™ 780 Processor; 2nd gen Qualcomm® Sensing Hub, Large shared AI memory, Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Qualcomm® Hexagon™ Tensor Accelerator

调制解调器

Modem Name: Qualcomm® Snapdragon™ X60 5G Modem-RF System

Peak Download Speed: 7.5 Gbps

Peak Upload Speed: 3 Gbps

Performance Enhancement Technologies: Qualcomm® AI-Enhanced Signal Boost adaptive antenna tuning, Qualcomm® Wideband Envelope Tracking, Qualcomm® Smart Transmit™ technology, Qualcomm® 5G PowerSave

5G Spectrum: Dynamic Spectrum Sharing (DSS), mmWave, sub-6 GHz

5G mmWave specs: 800 MHz bandwidth, 8 carriers, 2x2 MIMO

5G sub-6 GHz specs: 200 MHz bandwidth, 4x4 MIMO

Multi-SIM features: Global 5G multi-SIM

Cellular Technology: 5G NR, LTE including CBRS support, HSPA, WCDMA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

5G Downlink speed:  Up to 7.5 Gbps

Wi-Fi

Wi-Fi Standards: Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, 802.11a/b/g, 802.11n

Qualcomm® Wi-Fi 6 technology features: 160 MHz channel support, MU-MIMO (Uplink and Downlink), 8x8 sounding, 4K QAM, OFDMA (Uplink and Downlink), WPA3 security support, 6 GHz operation (Wi-Fi 6E)

Wi-Fi Spectral Bands: 2.4GHz, 5GHz, 6GHz

Bluetooth

Bluetooth Audio:  Qualcomm® aptX™ Adaptive Audio,  LE Audio Features, Qualcomm TrueWireless™ Technology, Bluetooth 5.2

NFC

Near Field Communications: Supported

定位

Satellite Systems Support: Beidou, Galileo, GLONASS, Dual frequency GNSS, NavIC, NavIC enabled, GPS, GNSS, QZSS, SBAS

USB

USB Version: USB 3.1, USB-C

CPU

CPU Clock Speed: Up to 2.84 GHz

CPU Architecture: 64-bit

制程

Process Technology: 5 nm

Qualcomm® FastConnect™ Subsystem

Wi-Fi/Bluetooth Subsystem: Qualcomm® FastConnect™ 6900

Bluetooth Features: Qualcomm® aptX™ Voice, Qualcomm® TrueWireless™ Technology, Bluetooth 5.2, LE Audio Features (broadcast audio), Qualcomm® aptX™ Adaptive Audio, Dual Bluetooth Antennas

Wi-Fi 6 features: 6 GHz operation (Wi-Fi 6E), MU-MIMO (Uplink and Downlink), 8x8 sounding, 4K QAM, OFDMA (Uplink and Downlink), WPA3 security support, 4-Stream Dual-band simultaneous, Dual-band simultaneous (DBS), 160 MHz channel support, Target Wake Time

相机

Image Signal Processor: Qualcomm Spectra™ 580 image signal processor, Triple 14-bit CV-ISPs, Hardware accelerator for computer vision (CV-ISP)

Dual Camera, MFNR, ZSL, 30fps: Up to 64 MP

Triple Camera, MFNR,, 30fps, ZSL: Up to 28 MP

Single Camera, MFNR, ZSL, 30fps: Up to 84 MP

Single Camera: Up to 200 MP

Camera Features: Real-time object classification, Low light photography architecture, 10-bit HDR HEIF photo capture, Multi-frame Noise Reduction (MFNR)

Slow Motion Video Capture: 720p @ 960 FPS

Video Capture Formats: Dolby Vision, HDR10, HDR10+, HEVC

Video Capture Features: Rec. 2020 color gamut video capture, 4K HDR with Computational HD, 8K video capture at 30fps, Up to 10-bit color depth video capture

Video

Codec Support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9

屏幕

Max On-Device Display: 4K @ 60 Hz, QHD+ @ 144 Hz

Display Features: Demura and subpixel rendering for OLED uniformity

Max External Display: 4K @ 60 Hz

HDR: HDR10+, HLG, Dolby Vision, HDR10

Color Depth: Up to 10-bit

Color Gamut: Rec2020

General Audio

Audio Technology: Qualcomm Aqstic™ smart speaker amplifier up to Qualcomm® WSA8835, Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385, Qualcomm Aqstic™ audio technology

GPU

GPU Video Playback: Volumetric VR video playback, 8K 360 VR video playback

API Support: OpenCL™ 2.0 FP, OpenGL® ES 3.2, Vulkan® 1.1, DX12

Security Support

Fingerprint Sensor: Qualcomm® 3D Sonic, Qualcomm® 3D Sonic Max 

Secure Processing Unit: Biometric Authentication (Fingerprint, Iris, Voice, Face)